Tesla stock climbed 3.2% in morning trading to reach $359.85, driven by the confirmation that its Optimus humanoid robot has entered the production phase at its Fremont, California facility. ^[1] Taiwan's Economic Minister Kuo Ming-shin said on 2026-09-02 at the Semicon Taiwan 2026 opening ceremony in Taipei that Taiwanese companies plan to invest an additional $20 billion in the US. ^[2] Hanmi Semiconductor announced at the SEMICON Taiwan 2026 exhibition that it is expanding its business scope to include 2.5D packaging equipment for AI system semiconductors. ^[3] Tesla launched a simplified, lower-priced rear-wheel-drive Model 3 in Hong Kong starting at approximately USD 26,000, representing an 8.5% reduction from the previous entry-level price. ^[4] The Optimus production ramp is designed to leverage existing Model S and Model X assembly lines, with robots initially deployed within Tesla's own factories as part of a closed-loop learning program called 'Optimus Academy'. ^[5] Ajit Manocha, CEO of SEMI, predicted at the opening ceremony that the global semiconductor industry will continue to grow significantly due to the AI boom, and expects global semiconductor production value to reach $2 trillion by 2030. ^[6] Kuo Ming-shin said the Taiwan Economic Ministry identified these investment plans after attending the 2026 Select USA event in Maryland in May 2026. ^[7] The US, which does not have formal diplomatic relations with Taiwan, is Taiwan's most important international supporter and arms supplier, and has been pressuring Taiwanese tech companies to increase US investment to expand domestic semiconductor production. ^[8] Hanmi Semiconductor reported that the FC Bonder 3.5, FC Bonder 75, 2.5D TC Bonder 40 C2S, and 2.5D TC Bonder 40 C2W have been released since the end of last year and are being supplied for mass production to global foundries and OSAT vendors. ^[9] Hanmi Semiconductor stated that it will display advanced packaging equipment including a 2.5D TC (Thermo Compression) bonder and an HBM (High Bandwidth Memory) TC bonder at the exhibition running from February 2 to 4. ^[10] The company showcased five 2.5D packaging equipment models: FC Bonder 3.5, FC Bonder 75, 2.5D TC Bonder 40 C2S, 2.5D TC Bonder 40 C2W, and 2.5D TC Bonder 120. ^[11] The S&P 500 and Nasdaq Composite were both trading in negative territory on the day of the report. ^[12]